博士生

当前位置:首页  研究成员  博士生

刘言言

作者: 访问量:2536时间:2018-11-09

PhD candidate


Name: Yan Yan LIU (刘言言)

E-mail: liuyanyan@nuaa.edu.cn

Education:

BEng (09/2015 - 06/2019) College of Aerospace Engineering, Nanjing University of Aeronautics and Astronautics

PhD (09/2019 - present) College of Aerospace Engineering, Nanjing University of Aeronautics and Astronautics (Supervisors: Profs. T.J. Lu & T. Kim, and Dr. S.W. Schekman at Wits University, South Africa)

Research interests:

Microelectronics cooling

Journal articles:

  1. Y.Y. Liu, S.W. Schekman, Y.P. Wang, T.J. Lu, T. Kim, “A cavitied microchannel coldplate subjected to slot bifurcation for advanced electronics cooling, IEEE Transactions on Electronics Packaging Manufactureing (In preparation).

  2. Y.Y. Liu, S.W. Schekman, T.J. Lu, T. Kim, “An enhanced cooling strategy by a circular, cavitied microtube cold plate,Journal of Heat and Mass Transfer-The transactions of the ASME (In preparation).

  3. Y.Y. Liu, S.W. Schekman, M.X. Li, T.J. Lu, T. Kim, “Transitional pressure drop in a cavitied microchannel, Physical Review Fluids 9 (2024) 044201.

  4. P.X. Niu, M.D. Atkins, Y.Y. Liu, T.J. Lu, T. Kim, Kinematic responses of an autorotating samara to concentrated crosswind, Physics of Fluids 34 (2022) 111912 (Selected as a Featured article and  Scilight by AIP publishing).

  5. P.X. Niu, M.D. Atkins, Y.Y. Liu, M.X. Li, T.J. Lu, T. Kim, Intrinsic equilibrium of stably autorotating samaras, Physical Review E 106 (2022) 014405.

  6. Y.Y. Liu, T.I. Bhaiyat, S.W. Schekman, T.J. Lu, T. Kim, Impingement cooling of an isoflux flat plate by blockage jet, Applied Thermal Engineering 209 (2022) 118239.

  7. C.Y. Zhang, Y.Y. Liu, T.I. Bhaiyat, S.W. Schekman, T.J. Lu, T. Kim, Impingement cooling by multiple asymmetric orifice jets, Journal of Heat Transfer-The transactions of the ASME 144 (2022) 042301-1.

Books:

  1. T. Kim, M.D. Atkins, Y.Y. Liu, T.J. Lu, Elemental Engineering Heat Transfer (In preparation)

Patents:

  1. Y.Y. Liu, T. Kim, T.J. Lu, A new cold plate design for electronics cooling (In preparation)

Awards and recognition:

  1. 07/2019: Outstanding Undergraduate Graduation Thesis


地址:江苏省南京市秦淮区御道街 29 号 邮政编码: 210016

Copyright 2021 多功能轻量化材料与结构工信部重点实验室保留所有权利