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Forced Convection in a Microchannel for Electronics Cooling

作者: 访问量:439时间:2021-10-18

Date and Time: 19th of October (Tuesday), 4PM

Venue: Tencent Meeting Room (ID:939 290 165)

Presenter: Dr. M. Marzougui, Faculty of Sciences of Tunis, University of Tunis El Manar, Tunisia



Abstract:

With the advances in micro-machining technology, the size of Micro-Electro-Mechanical Systems (MEMS) is reducing day by day and power density of microdevices is increasing, posing a problem for thermal control and heat dissipation from these devices. The reduced size has increased the heat flux density which causes overheating of devices and makes the overall well-being and proper functioning of these devices a big challenge for researchers. So, there is a need to develop highly efficient cooling technology and heat dissipation methods to meet the safety and stable operation of MEMS. The simplest arrangements commonly used to this effect are microchannels. In a microchannel a fluid is used to carry away heat from the small hot surface by forcing it through passages. As a microchannel has higher heat transfer surface area to fluid volume ratio, it provides a high heat transfer coefficient for convective heat transfer. It has been also observed that nanofluids as coolants in microchannels have excellent potential to enhance the heat transfer performance and are quickly establishing as future coolant to be reckoned with. In this talk, I will describe the investigations conducted to study the thermal performance of several heat exchangers used to cool an electronic chip. Some parameters were considered to determine their effects on system efficiency in terms of cooling.


Bio:

At present, I am an Assistant Professor at the Faculty of Sciences of Tunis, University of Tunis El Manar, Tunisia. My research interests include novel heat transfer technologies, heat transfer enhancement for mini and microchannel flows used in cooling of electronics deployed in ships, Computational Fluid Dynamics & Computational Heat Transfer (CFD/CHT) and its applications, and new cooling techniques for meeting cooling requirements of next generation supercomputers.






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